Due to up to ten programmable parameters as soldering temperature, cycle time, wave height, ramp up and ramp down, operator independent, precise and repeatable soldering results occur with the SSM 9.
The preheater module PH 4 can be used as individual device or together with the SSM 4A or the SSM 9. Due to preheating of the printed circuit board before the soldering process, the risk of delamination of the copper can be reduced. The preheater PH 4 uses IR technology to preheat the printed circuit board on an area of 300 x 300 mm with a performance of 3500 watt.
Damaged components can be replaced
Prototypes can be equipped and soldered with the SSM machines
THT Components that are missing at assembly time can be placed and soldered later, or individual THT components which cannot be handled by the available production machines can be retrofitted with the SSM 9.
If only a few components need to be placed on a circuit board, a SSM soldering- and desoldering machine often is the easiest and most economical way.
The ergonomic design allows to work fast and easy and guarantee highest precision results.
ZEVAC AG Switzerland
T +41 32 626 20 80
F +41 32 626 20 90
ZEVAC AG Germany
Bretonischer Ring 15
T +49 89 46 16 96 3
F +49 89 46 16 96 46