The developed dust and particles from the milling process are completely vacuumed in the closed processing chamber. The rest solder between the printed circuit board and the component can be removed mechanically and gently up to an exact definable height. Potential “underfill” material can also be removed within the same process. Trough parallel milling of the existing solder, printed circuit boards, master cards or substrates can be prepared for the placement of new components. The substrate is not harmed by the milling process and provides excellent surface conditions for the solder process of the new components and neighbor components are not being influenced. New components can be placed and soldered immediately with other products from Zevac, e.g. with the ONYX 29. For forensic applications, instead of the substrate, the actual components can be saved by milling out the substrate below the component.
Optionally the ONYX Milling machine can also be expanded to a dispensing machine to apply new solder