ZEVAC – WE MAKE YOUR PRODUCTS WORK

ZEVAC develops and produces machines for the component placement and the component interconnection technology including soldering processes, focusing on printed circuit board repair systems within the manufacturing process  of the electronics industry.

Development: 100% in Switzerland – Production: 95% in Switzerland


May 2019: Launching of the new ONYX MILLING machine

Precise process accuracy, precision in μm

The rest solder between the printed circuit board and the component can be removedThe rest solder between the printed circuit board and the component can be removedmechanically and gently up to an exact definable height.

High frequency precision spindle 80`000 min-1
Entire process without any tool change
A clean surface results, perfect for the placement and soldering of new components
  • Precise process accuracy, precision in μm
  • The rest solder between the printed circuit board and the component can be removedThe rest solder between the printed circuit board and the component can be removedmechanically and gently up to an exact definable height.

  • High frequency precision spindle 80`000 min-1
  • Entire process without any tool change
  • A clean surface results, perfect for the placement and soldering of new components

Upcoming exhibitions and events


10th Berlin Technology Forum
Berlin, Germany, May 23, 2019


Zevac Messe Nepcon Shenzhen

Shenzhen, China, August 28 - 30, 2019



ZEVAC AG
Vogelherdstrasse 4
CH-4500 Solothurn

T  +41 32 626 20 80
F  +41 32 626 20 90
This email address is being protected from spambots. You need JavaScript enabled to view it.